Glass

Scheme Description:

An amorphous form of silicon dioxide with and without modifications. A hard and brittle, transparent material that acts as a substrate for various applications.  Specific types include fused silica, borosilicate glass and alkali-free glass.  Typical thicknesses are 0.3 – 5 mm with and without protectictive and optical coatings.

Major Considerations:

• Cut quality:
• Top-side and back-side chipping
• Cut perpendicularity
• Kerf side surface finish

Saw:

7122 , 7124 , High level of automation, process control tools and optimized blade size up to 5″ for best Cost of Ownership.

Blade:

• 2 and 4 Resin blades Q and E matrixes and Novus Sintered blades I series
• Diamond grit size: 15 – 53 microns (Resin) and 6 – 25 microns (Sintered)
• Thickness: .002 – .012

Process Parameters:

• Feed rate: 2 – 15 mm/sec
• Spindle speed: 2″ : 18 – 30 krpm
4″ :  8 – 16 krpm
• Dicing additives can reduce chipping and improve surface finish