SILICON WAFERS AND DISCRETE DEVICES

Scheme Description:

Silicon is the most common semiconductor material used. It is a gray brittle material with a diamond cubic structure. Silicon wafers are available in sizes up to 12″ in diameter, with 6″ and 8″ being the most common.  Typical thicknesses are in the 100 – 650 micron range.

Major Considerations:

• Cut quality:
• Top-side and back-side chipping
• Cracking Wafer contamination due to ESD issues and poor cleaning

Saw:

7222, fully automatic dicing saw with WX3 wafer handling system for better throughput and Atomized cleaning or the 7900 Duo automatic Twin spindles for double the throughput

Blade:

• 2″ hub and Annular Nickel blades

Diamond grit size:

• 2-4 to 4-8 microns
• Thickness: .0008” – .0014”

Process Parameters:

• Feed rate: 25 – 75 mm/sec
• Spindle speed: 30 – 50 krpm
• Mounting: Blue or UV tape
• Cooling type: DI water with and without additives
• Carbon dioxide bubbler is optional