BGA Package Application

Scheme Description

Ball Grid Array (BGA) packages are based upon wire-bonded or flip-chipped dies mounted on an FR4/5 or BT resin based laminate.  The back side of the die is usually encapsulated in an epoxy resin.  The package has no leads and connects to the PCB by an array of solder balls.  Typical thicknesses are 0.9 – 2.0 mm (including solder balls).  Most common package sizes are 4×4 to 20×20 mm.

Major Considerations:

• Cut quality:
• Chipping
• Slivers
• Protrusions
• Trace shorts

End of Blade life:

• Package size
• End of Exposure

Saw:

7223, Fully automatic dicing system with built-in cleaning and UV curing, extended Y-travel for dual panel large size QFN’s and 2.4KW High torque spindle.

Blade:

• 2″ & 3″ Sintered blades “42”, “B”, “A” matrixes and 2″ Novus “B” series blades for tape and jig-mounted substrates
• Diamond grit size: 30 – 55 microns
• Thickness: .008” – .014”

Process Parameters:

• Feed rate: 75-200 mm/sec
• Spindle speed:  2″ : 30-45 krpm
3″ :  20-30 krpm
4″ :  10-16  krpm
• Multi panel mounting on UV tape
• Minimal dressing in order to avoid large radius on the blade edge