LED PACKAGING

Scheme Description：

LED packaging usually consists of a base substarate upon which the LEDs are mounted.
Common base substrates in the market are: Cermaic, PCB and QFN

Major Considerations:

• Chipping
• Cracks
• Copper or Silicon burrs
• Smearing
• Delamination

Saw:

7132 or 7900LA , Automation and quality control, automatic vision capabilities for multi panel using large area cutting chuck

Blade and Process Parameters:

ADT developed a dicing solution tailored to the specific package type: Ceramic, PCB and QFN