Microelectronic Components(MEC)

Scheme Description

The microelectronics industry is constantly seeking improved yields in a wide variety of complicated dicing applications. Continuous efforts are being made to improve both cut quality and throughput. Some new materials have been introduced that require new processes (blades and saws). These trends are accompanied by continuous efforts to further miniaturize die sizes, in order to maximize the number of dies per substrate. To achieve these goals, it is necessary to optimize the dicing process.

“Process Optimization of Dicing Microelectronic Substrates”
Gideon Levinson, Senior Dicing Blades R&D Specialist