PROCESS SOLUTIONS

Scheme Description

Optimization of the wafer dicing process involves precise control of many variables that are both directly and indirectly affected by such properties as material hardness, brittleness, and thickness. As new wafer materials, such as: gallium arsenide, lithium tantalite, and even copper, join the mix with standard silicon, semiconductor manufacturers face new and greater challenges in maintaining and improving dicing productivity.
At ADT, we continuously develop ways to quantify and regulate dicing blade materials and characteristics, to improve and enhance cut quality, blade life and throughput.