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Products

967, 967L

Semi Auto Wafer Mounter

Crafted with the primary purpose of automatically affixing wafers onto tape, the ADT 967 Semi-Automatic Wafer Mounting System showcases a harmonious blend of intelligence and user-friendliness. This remarkable product holds significant value and is the ultimate selection for mounting during production processes.

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Product Introduction

Crafted with the primary purpose of automatically affixing wafers onto tape, the ADT 967 Semi-Automatic Wafer Mounting System showcases a harmonious blend of intelligence and user-friendliness. This remarkable product holds significant value and is the ultimate selection for mounting during production processes.

Machine Feature

  • Automatic- Controlled process, hands free operation
  • Small footprint – Tabletop design
  • Quick and simple to use
  • Minimal tape usage
  • Flexible design – supports a wide variety of tapes & frames
  • Can be customized for multiple substrates (multi-panel) and irregular frames.

Options

  • Non-Contact mounting
  • Electro-Static eliminator
  • Rectangle frame support
  • Auto frame size detector and cutter
  • Top wafer surface lamination
  • Communication and control features
  • Special customized solutions

Specification

967 967L
Supported tapes Dicing Blue-tapes / UV tapes
Max. workpiece size 200mm (8″) 300mm(12″)
Supported film rames DTF 2-8-1 ; DTF 2-6-1

350-103 ; 350-104

DTF-2-12

SEMI-G74

Temp Controlled Chuck heater <65℃
Roller pressure 1-6 bar (adjustable)
Mounting time 25 sec. 35 sec.
Machine dimensions (WxDxH) 655 x 590 x 560 mm 791 x 706 x 557 mm
Approx. machine weight 65 kg 85 kg
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