8020

8-inch dual-spindle fully automatic dicer

8" silicon wafer dicing saw or other material such as Glass, SiC and more

The equipment has been fully upgraded, with excellent quality, efficiency, and operating experience, and has received high praise from users.
The preferred model for domestic replacement of semiconductor wafer cutting equipment in the top 10 semiconductor packaging and testing factories.
The core components of the entire machine are independently controllable and are not affected by global economic and political changes.

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Product Introduction Machine Feature Specification

8″ silicon wafer dicing saw or other material such as Glass, SiC and more

Workpiece Size		∅8″
Spindle		Two facing 1.8 kW or 2.2 kW, max. 60,000 rpm
Blade Size		2″~3″
Y1/ Y2 Axis	Control	Linear encoder for each Y axis
	Resolution	0.1 μm
	Cumulative Accuracy	1.5 μm
	Indexing Accuracy	1.0 μm
	Cutting range	210 mm
X Axis		Air Slide
Z1/Z2 Axis	Resolution	0.2 μm
	Repeatability	1.0 μm
	Max. Stroke	30 mm (for 2.188” blade OD)
θ Axis	Repeatability	4 arc-sec
θ Axis	Stroke	380°
Cleaning Station		Full rinse and dry cycle
	Spinning speed	100-3,000 rpm
	Cleaning Method	Atomized Cleaning Capabilities
Utilities	Electrical	200-240VAC，50-60Hz，single phase
Dimension	(W x D x H) mm	1820 × 1460 × 1015
Dimension	Weight	1300 kg

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