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Products

72XX series

8/12-inch single-spindle fully automatic dicer

7222 is used for cutting 8-inch wafers and materials such as PZT and IR glass. 7232 is used for cutting large substrates and multi-layered substrates. 7224 is used for cutting 8-inch thick glass, ceramics, and other hard materials. 7234 is used for cutting 12-inch thick glass, ceramics, and other hard materials. 7302 is an advanced version of 7232 with a larger chuck size of 12"×10". 7304 is an advanced version of 7234 with a larger chuck size of 12"×10".

  • Efficient wafer handling system
  • Blade wear prediction algorithm to reduce height measurement time and increase hourly output
  • The core components of the entire machine are independently controllable and are not affected by global economic and political changes
  • Atomized wafer cleaning technology, with excellent process effect.
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Product Introduction

7222 is used for cutting 8-inch wafers and materials such as PZT and IR glass.
7232 is used for cutting large substrates and multi-layered substrates.
7224 is used for cutting 8-inch thick glass, ceramics, and other hard materials.
7234 is used for cutting 12-inch thick glass, ceramics, and other hard materials.
7302 is an advanced version of 7232 with a larger chuck size of 12″×10″.
7304 is an advanced version of 7234 with a larger chuck size of 12″×10″.

Machine Feature

  • Efficient wafer handling system
  • Blade wear prediction algorithm to reduce height measurement time and increase hourly output
  • Continuous digital zoom vision system
  • Atomized wafer cleaning technology, with excellent process effect

 

Specification

72XXseries 

7222 7232 7224 7234 7302 7304
Workpiece Size ∅8″ ∅12″ ∅8″ ∅12″ 12″ ×9″ or ∅12″ 12″ ×9″
Spindle 60K rpm/1.8kW or 2.2kW 30K rpm/2.5kW 60K rpm/1.8kW 30K rpm/2.5kW
Blade Size 2″~3″ 4″~5″ 2″~3″ 4″~5″
Dimensions 965×1785×1700 1100×1785×1700 965×1460×1700 1100×1785×1700
Weight 1200 kg 1350 kg 1200 kg 1350 kg
Y-axis Controller Linear encoder/Y-axis
Resolution 0.1 μm
Cumulative Accuracy 1.5 μm
Indexing Accuracy 1.0 μm
X-axis Air Slide
Z-axis Repeatability Accuracy 1.0 μm
Maximum Travel 30 mm (2.188″ Blade Outer Diameter)
Resolution 0.2 μm
θ-axis Repeatability Accuracy 4 arc-sec
Stroke 380°
Cleaning Station Complete Rinse and Dry Cycle
Rotation Speed 100~2,000 rpm
Cleaning Method Atomized cleaning capabilities
Electrical 200~240VAC,50-60Hz,single phase
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