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Sintered Blades

Sintered Blades

With a slower wear rate than Resin but faster than Nickel, Metal-bond (Sintered) blades are best suited for retaining package shape and size in applications such as: BGA, Soft Alumina, TiC, LTCC, Ferrite.

· Various substrates, suitable for various applications

· High-precision cutting

· Reduce wear and increase blade life

· Reduce overall purchase costs (CoO)

· High-precision blade dimensions

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Product Introduction

With a slower wear rate than Resin but faster than Nickel, Metal-bond (Sintered) blades are best suited for retaining package shape and size in applications such as: BGA, Soft Alumina, TiC, LTCC, Ferrite.

 

Blade thickness: 80 – 1500µm
Diamond grit size: 2 – 70 µm
Serrations:
Serrations available for sintered blades as well as various edge shapes

Blade Feature

Blade Application

Diamond grit size (µm) Product Material Matrix
45 up to 55 BGA , LGA (Tape & Tape-less mounting method) FR4, Plastic & molding C2/R5
30 up to 50 QFN ( Half Etched) Cu leadframe + molding Q7/C1
35 up to 45 Passive & Active Devices. Communication Modules LTCC P1/P9
35 up to 45 SAW Devices, RF Package HTCC P1
13 up to 25 Camera Module Glass/ IR Glass P1/P5
25 up to 45 Ceramic Packages Alumina P5/P9

Metal Sintered Blades Part Number Description

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